About Session
| Time | Presentation | Description |
|---|---|---|
| 1:30 PM | Maybell Technologies: Densely Integrated Cryogenic Device Interposers for Scalable Quantum Computing | Conventional approaches to superconducting qubit control and readout, built on off-the-shelf microwave hardware, are suitable for small-scale experiments (10s of qubits) but do not scale well. Their large footprint and thermal load make expansion beyond 100+ qubits impractical, while microwave interconnects introduce noise and other non-idealities that reduce qubit fidelity. Maybell’s Flexline interposers address these challenges by enabling high signal density with integrated components, tightly integrated into a cryogenic-compatible solution without compromising performance. Using high-density traces (3 mm pitch) and an interposer design that integrates passive components such as attenuators and filters, Flexline substantially reduces the cryogenic interconnect footprint while maintaining signal integrity. Maybell’s approach delivers higher signal density in smaller volumes, with reduced thermal and vibrational load, while offering equal or better electrical performance compared to traditional approaches. |
| 1:50 PM | XMA: High Density Flex Cabling – Benefits, Challenges and Lessons Learned | With Quantum Computing roadmaps expressing the need to increase Qubit counts, higher-density communication hardware becomes a necessity for both command and readout signals. XMA is actively working with QED-C to identify hardware configurations and risks associated with current technology by addressing the following topics: Topic 1: Reducing both the thermal load and physical footprint associated with microwave control cabling in cryogenic environments. Topic 2: Locating digital and mixed-signal electronics closer to the quantum processor in cryogenic environments. Topic 3: Enabling tighter integration of active components (e.g., amplifiers, active circulators, switches, etc.) and passive components (e.g., filters, attenuators, couplers, splitters, passive circulators, etc.) with each other and with quantum devices in cryogenic environments. Topic 4: Reducing the size, weight, and power (SWaP) of room temperature control and readout electronics. Under the direction of QED-C and the AFRL, XMA is actively working on the grant program labelled “High Density Integrated RF Control and Readout Electronics”. Our presntation will highlight various product design efforts, the merits of our findings and the challenges for meeting demands on full-rate production presentation |
| 2:10 PM | Amphenol RF: High Density RF Interconnect Development for Room Temperature Control Readout Electronics | Reducing the size, weight and power (SWaP) of room temperature control readout electronics requires a concomitant decrease in the electronic interconnect devices. Amphenol RF’s project optimizes and validates a new cable to board interconnect technology to accomplish a reduction in pitch from 4.5 mm on existing platforms to 3 mm. To accomplish the goal, many technical challenges had to be overcome including low loss and high crosstalk resistance in a very dense package. |
| 2:30 PM | Rigetti Measuring What Matters: On-Chip Thermometry for Scalable Quantum Hardware | To build more reliable quantum computers, we need to know the actual temperature of the qubits—not just the fridge. Rigetti is developing compact, on-chip thermometers based on Dayem bridges to directly measure the temperature of superconducting quantum processors. These sensors would provide critical insight into thermal performance without impacting device operation, helping improve coherence and accelerate hardware development at scale. |
