QED-C Member Advances in Control & Readout Electronics

QED-C Member Advances in Control & Readout Electronics

November 5, 2025 @ 2:40 pm - 4:15 pm

  • Google Chelsea, Foyer Stage
  • Annual Meeting 2025, Technology and Infrastructure

About Session

TimePresentationDescription
2:40 PMMaybell Technologies: Densely Integrated Cryogenic Device Interposers for Scalable Quantum ComputingConventional approaches to superconducting qubit control and readout, built on off-the-shelf microwave hardware, are suitable for small-scale experiments (10s of qubits) but do not scale well. Their large footprint and thermal load make expansion beyond 100+ qubits impractical, while microwave interconnects introduce noise and other non-idealities that reduce qubit fidelity. Maybell’s Flexline interposers address these challenges by enabling high signal density with integrated components, tightly integrated into a cryogenic-compatible solution without compromising performance. Using high-density traces (3 mm pitch) and an interposer design that integrates passive components such as attenuators and filters, Flexline substantially reduces the cryogenic interconnect footprint while maintaining signal integrity. Maybell’s approach delivers higher signal density in smaller volumes, with reduced thermal and vibrational load, while offering equal or better electrical performance compared to traditional approaches.
3:00 PMXMA: Development of High Density Integrated RF Control and Readout ElectronicsXMA’s project addresses three important topics in quantum computing control and readout technologies: improving thermal loading, reducing the physical footprint of cryogenic microwave signals, and seamlessly integrating RF components to reduce size and improve electrical performance. XMA has applied expertise in RF, thin film deposition, and cryogenics to develop a high-density system in three stages: High-Density Flex cabling, High-Density Carriers, and High-Density Devices including attenuators, IR filters, amplifiers, and mixers. The impacts of this new system on QIST are (1) increased density of RF lines, (2) reduced thermal loading of signal lines, and (3) tighter integration of passive RF components. All efforts increase the number of qubits under test and reduce the monetary cost of control and readout electronics.
3:20 PMAmphenol RF: High Density RF Interconnect Development for Room Temperature Control Readout ElectronicsReducing the size, weight and power (SWaP) of room temperature control readout electronics requires a concomitant decrease in the electronic interconnect devices. Amphenol RF’s project optimizes and validates a new cable to board interconnect technology to accomplish a reduction in pitch from 4.5 mm on existing platforms to 3 mm.  To accomplish the goal, many technical challenges had to be overcome including low loss and high crosstalk resistance in a very dense package. 
3:40 PMRigetti Measuring What Matters: On-Chip Thermometry for Scalable Quantum HardwareTo build more reliable quantum computers, we need to know the actual temperature of the qubits—not just the fridge. Rigetti is developing compact, on-chip thermometers based on Dayem bridges to directly measure the temperature of superconducting quantum processors. These sensors would provide critical insight into thermal performance without impacting device operation, helping improve coherence and accelerate hardware development at scale.
4:00 PMGoogle-NIST: MEMS switches for increasing the quantity and quality of cryogenic RF measurementsSince superconducting qubit systems operate in ultra-cold, ultra-low noise environments it is important to maximize the data quantity and quality in each and every cool down to millikelvin temperatures. NIST is working with Menlo Micro and Google to develop MEMS-based, cryogenic-compatible switch networks. These networks are able to connect one input line to multiple devices and/or multiple devices to one output line (or both) which increases the quantity of testable devices per cooldown. We have also developed a way to use the same switches to connect to traceable calibration standards to characterize the full measurement chain. This high-quality measurement data will allow easier troubleshooting, more accurate device characterization, and novel measurement paradigms.

Speakers

Adam Sirois

Adam Sirois

Physicist, NIST
Ella Lachman

Ella Lachman

Senior Quantum Materials R&D Engineer, Rigetti
Owen Barthelmes

Owen Barthelmes

Director of Engineering, Amphenol RF

Nick O'Leary

Engineering Program Manager, XMA Corp

Joe Love

RF Design Engineer, XMA Corp
Marc Smith

Marc Smith

General Manager, XMA Corp
Corban Tillemann-Dick

Corban Tillemann-Dick

CEO, Maybell Quantum